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Whether you need rigid or flexible, single, double or multi-layered PCBs we can help... At QualiEco Circuits we advise on the manufacture and assemble of all types printed circuits board (PCBs)
Capability
QualiEco Circuits Australia's technical capability in detail for your PCB manufacturing requirements in medium volume – we’re always one step ahead in technology and innovation.
Rigid PCBs Medium Volume – In detail
DescriptionStandard PCBs Prototype PCBs
PCB Details
- Max. no. of layers1 to 12 LayersUp to 30 Layers
- Max. board size (L x W) in mm600mm x 500mm600mm x 1100mm
- Max. board thickness (in mm.)6mm6mm
- Min. finished board thickness (in mm.)0.4mm0.3mm
- Min. Core Thickness0.2mm0.1mm
- Min. Dielectric0.05mm0.05mm
Base Material
- (A) Base MaterialFR4 (Std, High Tg & HF)FR4 (Std, High Tg & HF)
- (B) Inner layer Copper cladding
- * Max. Cu Wt. For Planes (Oz.)70µm (2oz)70µm (2oz)
- * Max. Cu Wt. For Signals (Oz.)70µm (2oz)70µm (2oz)
- * Min. Cu Wt. (Oz.)18µm18µm
- (C) Outer layer Copper cladding
- *Max Cu Wt. (Oz.)210µm (6oz)210µm (6oz)
- *Min Cu Wt. (Oz.)18µm18µm
Etching
- Minimum (in mils)
- For copper thickness of 0.5 OzTrace Width: 5mil
Spacing: 5milTrace Width: 4mil
Spacing: 4mil - For copper thickness of 1.0 OzTrace Width: 6mil
Spacing: 6milTrace Width: 5mil
Spacing: 5mil - For copper thickness of 2.0 OzTrace Width: 7mil
Spacing: 7milTrace Width: 6mil
Spacing: 6mil - For copper thickness of 3.0 OzTrace Width: 9mil
Spacing: 9milTrace Width: 8mil
Spacing: 8mil
Drilling
- Min. finished via hole size
- Mechanical Drilling0.2mm0.2mm
- Laser Drilling- N/A -- N/A -
- Min. finished via pad size0.5mm0.5mm
- Min. annular ring (via holes)5 mils5 mils
- Min. annular ring (Component holes)8mil8 mils
- Min. hole size tolerance (in mils)
- Hole size < 0.024"PTH: +/-0.076mm
NPTH: +/-0.05mmPTH: +/-0.076mm
NPTH: +/-0.05mm - Hole size > 0.024" < 0.138"PTH: +/-0.076mm
NPTH: +/-0.05mmPTH: +/-0.076mm
NPTH: +/-0.05mm - Hole size > 0.138"PTH: +/-0.076mm
NPTH:+/-0.05mmPTH: +/-0.076mm
NPTH: +/-0.05mm - Blind & Buried vias manufacturableYESYES
- Drill to track clearance for inner layers0.25mm (4L)
0.30mm (6L)
0.40mm (8L)
0.50mm (10L)0.25mm (4L)
0.30mm (6L)
0.40mm (8L)
0.50mm (10L) - Min. annular ring (Component holes)0.2mm to 0.4mm0.2mm to 0.4mm
Plating / Surface Treatment
- HASLYESYES
- Electrolytic GoldYESYES
- Electroless Nickel / GoldYESYES
- SMOBC with OSP (Entek Coating)YESYES
- Immersion SilverYESYES
- Immersion TinYESYES
Layer construction & Impedance Design
- Min. core thickness0.1mm (H/H oz)0.1mm (H/H oz)
- Preferred varieties of Thin core laminates generally stocked (in mils)0.1/ 0.13/ 0.15/ 0.2/ 0.27/ 0.3/ 0.35/ 0.4/ 0.5/ 0.6/ 0.8/ 1.0/ 1.2mm
4, 20, 24, 28, 47.24 & 59mil0.1/ 0.13/ 0.15/ 0.2/ 0.27/ 0.3/ 0.35/ 0.4/ 0.5/ 0.6/ 0.8/ 1.0/ 1.2mm
4, 20, 24, 28, 47.24 & 59mil - Prepregs generally stocked (in mils)3, 5 & 7mil3, 5 & 7mil
Maximum Fabrication Tolerance
- Maximum Fabrication Tolerance+/-10% of finished board thickness+/-10% of finished board thickness
Solder mask
- Mask opening (pad + XXX)3mil3mil
- Min. solder mask web width between pads6mil4mil
- PAD to PAD min. space if web required3mil3mil
- SM clearance to PAD4mil4mil
- Min. SM thickness8µm8µm
Component Reference (Silk Screen)
- Legend (Silk Screen) line width≥6mil4mil
- Min. character height≥0.8mm≥0.8mm
- Min. character spacing≥6mil≥5mil
Electrical Test
- CAD net list testing (IPC356D)PossiblePossible
- Min. SMD pitch testable0.4mm0.4mm
- Min SMD pad width testable0.2mm0.1mm
- Max testing area (mm x mm)600mm x 600mm600mm x 600mm
- Testing voltage250V DC250V DC
- Open resistance20MΩ20MΩ
- Short resistance50MΩ50MΩ
- Top and Bottom Test simultaneouslyYESYES
Controlled Impedance measurement
- Controlled Impedance measurementYESYES
Inner Layers (VCC and GND Layers)
- Minimum Isolation from finished Drill0.25mm (4L)
0.30mm (6L)
0.40mm (8L)
0.50mm (10L)0.25mm (4L)
0.30mm (6L)
0.40mm (8L)
0.50mm (10L) - Up to 8 Layers (Single Stage bonding)0.26mm0.21mm
- Up to 8 Layers (Two times bonding)0.26mm0.23mm
- Up to 8 layers (more than two times)0.26mm0.23mm
- Above 8 layers(Single Stage bonding)0.26mm0.26mm
- Min. Annular ring for thermal pads0.31mm0.26mm
- Min. Thermal Air Gap0.3mm0.25mm
- Cu area to PCB edge clearance0.4mm0.25mm
Inner Layers (Signal Layers)
- Minimum Annular Ring0.15mm0.13mm
- Finished Drill to Track clearance
- Up to 8 Layers (Single Stage bonding)0.25mm0.21mm
- Up to 8 Layers (Two times bonding)0.31mm0.26mm
- Up to 8 layers (more than two times)0.36mm0.31mm
- Above 8 layers(Single Stage bonding)0.26mm0.31mm
- Cu area to PCB edge clearance0.4mm0.25mm
Scoring (V-cut)
- Score line to Cu area clearance0.3mm0.25mm
Routing
- Minimum router diameter0.8mm0.8mm
- Cu area to PCB edge clearance (Outer Layer)0.25mm0.15mm
- Cu area to PCB edge clearance (Inner Layer)0.25mm0.25mm
Slot
- Minimum slot size0.8mm0.8mm
1. We prefer min. pad size >= hole size + 0.50 mm for any PTH hole.
2. NPTH holes should preferably not have any pad around them.
3. Jump scoring and depth routing possible – conditions apply
Product Comparison Chart
We have the capability to manufacture and assemble Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 32 layers) PCBs with RoHS as an option.
Compare Low Cost Prototype with Standard Prototype and Production. Choose one which best suits your requirements.
Compare now!Our capabilities
We can manufacture and assemble Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 32 layers) PCBs with RoHS as an option.
Need to know more about our capabilities?
What our customers say?
QualiEco Circuits Limited is an excellent supplier to us! We appreciate the quality of service and support that we receive from QualiEco Circuits. They always deliver what is promised
For printed circuit boards (PCBs) or PCB assembly you can count on. Talk to the friendly and experienced team at QualiEco Circuits, New Zealand.