QualiEco Technology
Simple but Smart solutions is our expertise... We believe in being one step ahead in technology and innovation at all times!!! Technical Capability Statement - In Detail
PCB Details
- Max. no. of layers1818
- Max. board size (L x W) in mm650 x 305650 x 305
- Max. board thickness (in mm.)3.20 mm3.20 mm
- Min. finished board thickness (in mm.)0.40 mm (No HAL)0.40 mm (No HAL)
Base Material
- (A) Base MaterialFR4FR4
- (B) Inner layer Copper cladding
- * Max. Cu Wt. For Planes (Oz.)33
- * Max. Cu Wt. For Signals (Oz.)22
- * Min. Cu Wt. (Oz.)0.50.5
- (C) Outer layer Copper cladding
- *Max Cu Wt. (Oz.)36
- *Min Cu Wt. (Oz.)0.50.5
Etching
- Minimum (in mils)Trace WidthSpacingTrace WidthSpacing
- Max. board size (L x W) in mm5555
- Max. board thickness (in mm.)6666
- Min. finished board thickness (in mm.)7777
Drilling
- Min. finished via hole size12 mils10 mils
- Min. finished via pad size20 mils18 mils
- Min. annular ring (via holes)4 mils4 mils
- Min. annular ring (Component holes)8 mils8 mils
- Min. hole size tolerance (in mils)PTHNPTHPTHNPTH
- Hole size < 0.024"+/- 3+/- 2+/- 3+/- 2
- Hole size > 0.024" < 0.138"+/- 4 +/- 3 +/- 4 +/- 3
- Hole size > 0.138"+/- 6+/- 6 +/- 6+/- 6
- Blind & Buried vias manufacturableYESYESYESYES
- Drill to track clearance for inner layers14 mil14 mil10 mil10 mil
Plating / Surface Treatment
- Trace WidthSpacingTrace WidthSpacing
- HASLYESYESYESYES
- Electrolytic GoldYESYESYESYES
- Electroless Nickel / GoldYESYESYESYES
- SMOBC with OSP (Entek Coating)YESYESYESYES
- Immersion SilverYESYESYESYES
- Immersion TinYESYESYESYES
Layer construction & Impedance Design
- Min. core thickness8 mils6 mils
- Preferred varieties of Thin core laminates generally stocked (in mils) 8, 14, 288, 14, 28
- Prepregs generally stocked (in mils)4, 74, 7, 2.5
Maximum Fabrication Tolerance
- Maximum Fabrication Tolerance+/- 10%+/- 8%
Solder mask
- Solder maskXXX =XXX =
- Mask opening (pad + XXX)8 mils6 mils
- Min. solder mask web width between pads4.5 mils4 mils
- PAD to PAD min. space if web required12.5 mils12 mils
- SM clearance to PAD4 mils4 mils
- Min. SM thickness18 mils18 mils
Component Reference (Silk Screen)
- Legend (Silk Screen) line width9 mils5 mils
- Min. character height55 mils40 mils
- Min. character spacing8 mils6 mils
Electrical Test
- CAD net list testing (IPC356D)PossibleNot Possible
- Min. SMD pitch testable20 mils12 mils
- Min SMD pad width testable8 mils6 mils
- Max testing area (mm x mm)410 x 350
- Testing voltage40 volts240 volts
- Open resistance> 10 K ohms
- Short resistance5 ohms to 10 K ohms
- Top and Bottom Test simultaneouslyPossiblePossible
Controlled Impedance measurement
- Controlled Impedance measurement50, 100 ohms50, 100 ohms
Inner Layers (VCC and GND Layers)
- Minimum Isolation from finished Drill
- Up to 8 Layers (Single Stage bonding)0.45 mm0.45 mm
- Up to 8 Layers (Two times bonding)0.60 mm0.55 mm
- Up to 8 layers (more than two times)0.80 mm0.75 mm
- Above 8 layers(Single Stage bonding)0.80 mm0.75 mm
- Min. Annular ring for thermal pads4 mils2 mils
- Min. Thermal Air Gap0.25 mm0.25 mm
- Cu area to PCB edge clearance0.50 mm0.30 mm
Inner Layers (Signal Layers)
- Minimum Annular Ring5 mils4 mils
- Finished Drill to Track clearance
- Up to 8 Layers (Single Stage bonding)0.45 mm0.40 mm
- Up to 8 Layers (Two times bonding)0.60 mm0.55 mm
- Up to 8 layers (more than two times)0.80 mm0.75 mm
- Above 8 layers(Single Stage bonding)0.80 mm0.75 mm
- Cu area to PCB edge clearance0.50 mm0.30 mm
Scoring (V-cut)
- Score line to Cu area clearance> 0.40 mm0.40 mm
Routing
- Minimum router diameter1.2 mm*1.0 mm*
- Cu area to PCB edge clearance (Outer Layer)0.3 mm0.25 mm
- Cu area to PCB edge clearance (Inner Layer)0.50 mm0.40 mm
- * 0.8mm & 0.9mm router sizes also available and can be used for thin slots
1. Acceptance on manufacturability of Blind and buried vias will be given after studying Multi Layer
construction / Inner layer design.
2. We prefer min. pad size >= hole size + 0.50 mm for any PTH hole.
3. NPTH holes should preferably not have any pad around them.
4. Jump scoring and depth routing possible – conditions apply
Product Comparision Chart
We have capability to manufacture Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 24 layers) PCBs with RoHS as an option.
Compare Low Cost Prototype with Standard Prototype and Production. Choose one which
best suits your requirement.
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PCB Design Tips
When designing a PCB, try to limit
the amount of draws you use.
Draws use a lot of memory and slows the programming time. Ex.: Use a flash for pads instead of draws. If for some reason we need to increase or decrease that pad size, it can easily be done by changing the D-code but if they are done with draws it could be a nightmare.
Learn more