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Glossary and Abbreviations - PCB Glossary
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Alphabet L

  • LaminateA composite material made by bonding together several layers of same or different materials.
  • LaminationThe process of manufacturing a laminate using pressure and heat.
  • Laminate ThicknessThickness of the metal-clad base material, single or double-sided, prior to any subsequent processing.
  • Laminate VoidAn absence of epoxy resin in any cross-sectional area that should normally contain epoxy resin.
  • LandThe portion of the conductive pattern on printed circuits designated for the mounting or attachment of components. Also called a pad.
  • Laser Photo-PlotterA plotter that uses a laser, which simulates a vector photo-plotter by using software to create a raster image of the individual objects in a CAD database, then plots the image as a series of lines of dots at a very fine resolution. A laser photo-plotter is capable of more accurate and consistent plots than a vector plotter.
  • Layer SequenceLayer sequence helps to build the layer stack up from top to bottom and one can and its very help to CAD to identify the type of layer.
  • LayersThe layers give indication of different sides of PCB. On-board text such as company name, logo, or part number that is oriented right-reading on the top layer will quickly allow us to determine that files have been imported correctly. This simple step can save a time-consuming hold notice and potential hold up. Please note: any traces on outer layer that are 0.010" wide or less will require ½ ounce copper starting weight to prevent excessive trace width reduction.
  • Lay upThe process in which treated prepegs and copper foils are assembled for pressing.
  • Leakage CurrentA small amount of current that flows across a dielectric area between two adjacent conductors.
  • LegendA format of printed letters or symbols on the PCB, such as part numbers and product number or logos.
  • LotA quantity of circuit board that share a common design.
  • Lot CodeSome Customers require a manufacturer's lot code to be placed on the board for future tracking purposes. A drawing can specify the location, what layer and if it is to be in copper, mask opening, or silkscreen. This option is available on the Full-Featured instant quote.
  • LPI – (Liquid Photo-Imageable Solder Mask)An ink that is developed off using photographic imaging techniques to control deposition. It is the most accurate method of mask application and results in a thinner mask than dry film solder mask. It is often preferred for dense SMT. Application can be spray or curtain coat.
PCB Design Tips

PCB Design Tips

When designing a PCB, try to limit
the amount of draws you use.
Draws use a lot of memory and slows the programming time. Ex.: Use a flash for pads instead of draws. If for some reason we need to increase or decrease that pad size, it can easily be done by changing the D-code but if they are done with draws it could be a nightmare.

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