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Electropolished Laser Cut Framed Stencil

Electropolished Laser Cut Framed Stencil

Laser cut stencil is the best choice for medium to large volume assembly especially when fine pitch components are in use. We have noticed that many PCB designs are using extremely fine components such as QFP, BGA and CSP. Therefore, to add versatility in the usage of laser cut stencils, we have started supplying Electropolished stencils, which is the perfect answer to almost any fine pitch assembly requirement.

In addition to Electropolishing process, we have also included aluminum framing to all our laser cut stencils as standard feature to enable high volume screen printing. With a framed stencil, your stencil is securely mounted to either a cast or extruded aluminum stencil frame using a mesh border. This keeps the stencil foil taut, allowing for complete control. Our glue-in stencils are permanently bonded using an exclusive border treatment which, when combined with our epoxy process, creates a bond so strong it will not fail.

We also have capability to add haft-etch block mark fiducials and texts to assist in your assembly process.

Specification

  • Stencil thickness 2.0, 3.8, 4.0, 5.0, 6.0, 7.0, 8.0 mils
  • Pitch limit 2mils
  • Min. aperture size 2mils (on 2mils sheet thickness)
  • Min. distance between apertures Same as stencil thickness
  • Min. distance between two adjacent Aperture’s wall gap Same as stencil thickness
  • Repeatability (Uniformity) +/- 0.1um
  • Aspect Ratio ≥ 0.66 ( material thickness )
  • Cutting accuracy +/- 5um (over entire print area )
  • Positioning Error +/- 4um
  • Axial precision +/-10 µm
  • Edge roughness < 3 µm
  • All opening walls are trapezoidal 0.8 mil Taper? Yes
  • 100% inspection, post-manufacture? Yes

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Our Capabilities

We have capability to manufacture Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 24 layers) PCBs with RoHS as an option.

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